Selected Computer Circuitry Cooling Techniques

under construction

S/360 Model 91 - water cooled

tbd

IBM ACS - immersion in fluorocarbon

Amdahl 470 - air cooled


470 with panels removed	Fujitsu FACOM M-190 board (equivalent to 470 board)

R. Beall, "Packaging for a super computer," Proc. IEEE Intercon, March 1974, pp. 1-9
US Patent 3,808,475, Buelow and Zasio, LSI chip construction and method, 1974 (and 3,981,070, 1976)
US Patent 3,903,404, Beall, Buelow, and Zasio, Computer construction and method, 1975
US Patent 4,016,463, Beall, Buelow, and Zasio, High density multilayer printed circuit card assembly and method, 1977
US Patent 4,115,837, Beall and Zasio, LSI chip package and method, 1978 (and 4,396,971, 1983)

Amdahl 580 - air cooled

see photos at www.staff.ncl.ac.uk/roger.broughton/museum/circuitry/AMDAHL.htm

US Patent 4,292,647, Lee, Semiconductor package and electronic array having improved heat dissipation, 1981
US Patent 4,620,215, Lee, Integrated circuit packaging systems with double surface heat dissipation, 1986

Trilogy - water cooled

three parts of the chip module: signal connector, pressure contacter, and chip in water-cooled carrier

US Patent 4,603,345, J.C.K. Lee, et al., Module construction for semiconductor chip, filed March 1984, and issued July 1986
US Patent 4,617,475, R.M. Reinschmidt, Wired logic voting circuit, filed March 1984, and issued October 1986
US Patent 4,577,398, J.W. Sliwa, et al., Method for mounting a semiconductor chip, filed September 1984, and issued March 1986
US Patent 4,628,991, W.-T. Hsiao and H.A. Everling, Wafer scale integrated circuit testing chuck, filed November 1984, and issued December 1986
US Patent 4,737,839, R.J. Burt, Semiconductor chip mounting system, filed March 1986, and issued April 1988 (also US Patent 4,574,470)
US Patent 4,597,029, A. Kucharek, et al., Signal connection system for semiconductor chip, filed March 1984, and issued June 1986
... others ... look for assignees Trilogy Computer Development Partners and Trilogy Systems Corporation

Cray-2 - immersion in fluorocarbon

R. Danielson, N. Krajewski, and J. Brost, "Cooling a Superfast Computer," Electronic Packaging and Producton,, vol. 26, no. 7, 1986, pp. 44-45

ETA-10 - immersion in liquid nitrogen

A. Vacca, D. Resnick, D. Frankel, R. Back, J. Kreilich, and D. Carlson, "A Cryogenically Cooled CMOS VLSI Supercomputer," VLSI Systems Design,, vol. 8, no. 7, 1987, pp. 80-88

SS-1 - fluorocarbon jet impingement

P. Ing, et al., "SS-1 supercomputer cooling system," Proc. Electronic Components and Technology Conference, June 1993, pp. 218-237